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Lumentum showcased a 1060 nm VCSEL die-to-die interconnect with Qualcomm and Corning at ECOC 2026, citing ~1 Tb/s per mm today and a roadmap to ~4 Tb/s per mm. Director Erman Timurdogan will present Sept. 23 on scaling 800G and 1.6T silicon photonic transmission.
Lumentum, Qualcomm, and Corning will jointly demonstrate a high-density die-to-die optical interconnect for AI scale-up architectures at ECOC 2026. The showcase will feature a new optical architecture designed to extend high-bandwidth, low-power, low-latency connectivity over multimode fiber for future co-packaged opti