Lumentum shows 1060 nm VCSEL die-to-die interconnect at ECOC 2026

Lumentum showcased a 1060 nm VCSEL die-to-die interconnect with Qualcomm and Corning at ECOC 2026, citing ~1 Tb/s per mm today and a roadmap to ~4 Tb/s per mm. Director Erman Timurdogan will present Sept. 23 on scaling 800G and 1.6T silicon photonic transmission.