Lumentum, Qualcomm, Corning to Showcase AI Optical Connectivity Tech at ECOC 2026

Lumentum, Qualcomm, and Corning will jointly demonstrate a high-density die-to-die optical interconnect for AI scale-up architectures at ECOC 2026. The showcase will feature a new optical architecture designed to extend high-bandwidth, low-power, low-latency connectivity over multimode fiber for future co-packaged optics implementations.