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Lumentum plans a joint ECOC 2026 demonstration with Qualcomm Technologies, Corning on high-density optical die-to-die connectivity for AI scale-up. Board-level showcase targets co-packaged optics, near-packaged optics using emerging interfaces such as UCIe over multimode fiber spanning tens of meters. Proof-of-concept
Lumentum, Qualcomm, and Corning will jointly demonstrate a high-density die-to-die optical interconnect for AI scale-up architectures at ECOC 2026. The showcase will feature a new optical architecture designed to extend high-bandwidth, low-power, low-latency connectivity over multimode fiber for future co-packaged opti
Lumentum Holdings Inc. (“Lumentum”) today announced plans for a joint demonstration together with Qualcomm Technologies, Inc. and Corning Incorporated (NYSE: GLW) of a high-density die-to-die (D2D) optical interconnect showcase for AI scale-up architectures at ECOC 2026. The board-level demonstrati…