GlobalFoundries and RAAAM Memory develop next-gen GCRAM for FDX
Deal targets densest standard CMOS on-chip memory for the FDX platform used in advanced AI chips, aiming for 40% area shrink and up to 60% power reduction versus commodity SRAM.
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Deal targets densest standard CMOS on-chip memory for the FDX platform used in advanced AI chips, aiming for 40% area shrink and up to 60% power reduction versus commodity SRAM.
GFS and RAAAM Memory Technologies said they will jointly develop next-generation GCRAM technology and a test chip on the FDX platform.