GlobalFoundries and RAAAM Memory develop next-gen GCRAM for FDX
Deal targets densest standard CMOS on-chip memory for the FDX platform used in advanced AI chips, aiming for 40% area shrink and up to 60% power reduction versus commodity SRAM.
Collaboration targets to enable the densest standard CMOS on-chip memory solution for the FDX platform widely used for advanced AI chips, by delivering 40% area shrink and up to 60% power reduction compared to commodity SRAMMALTA, N.Y. and PETA TIKVA, Israel, Sept.
02, 2026 (GLOBE NEWSWIRE) -- Glob…