Daishin Securities Announces KRW 49.87 Billion Equity — Linked Bond Offering
Daishin Securities plans a KRW 49.87 billion equity-linked bond offering across two tranches. Series 1176 totals KRW 44.87 billion; Series 1177 totals KRW 5 billion. Subscription and issuance are scheduled for October 26, 2026, with maturity on October 26, 2027. Linked to Samsung Electronics common shares, Series 1176