Daishin Securities Announces KRW 49.87 Billion Equity — Linked Bond Offering

Daishin Securities plans a KRW 49.87 billion equity-linked bond offering across two tranches. Series 1176 totals KRW 44.87 billion; Series 1177 totals KRW 5 billion. Subscription and issuance are scheduled for October 26, 2026, with maturity on October 26, 2027. Linked to Samsung Electronics common shares, Series 1176 offers annual returns of 3.89%-3.9%; Series 1177 offers 4.19%-4.2%. Proceeds will fund hedging transactions and investments in financial products. Disclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. Daishin Securities Co. Ltd. published the original content used to generate this news brief via DART, the regulatory disclosure system operated by the South Korea Financial Supervisory Service (FSS) (Ref. ID: 20261015000319), on October 15, 2026, and is solely responsible for the information contained therein. (C)