nVent to Add Rack-Level Cooling to AMD Helios Platform
nVent will integrate its DC-powered rear-door heat exchanger and air/liquid cooling with AMD Helios Rackscale. The companies will unveil the open-source solution at the OCP Global Summit.
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nVent will integrate its DC-powered rear-door heat exchanger and air/liquid cooling with AMD Helios Rackscale. The companies will unveil the open-source solution at the OCP Global Summit.
nVent Electric entered a collaboration with AMD to develop rack-level cooling for AMD’s Helios Rackscale AI platform. The partnership adds nVent rear-door heat exchanger cooling to Helios to support high-density AI deployments at scale. Companies plan to show an initial look of the open-source solution at the OCP Globa