Wiwynn showcases AI platforms and technologies at 2026 OCP Global Summit
Wiwynn showcased AI platforms, thermal engineering and optical interconnect technologies at the 2026 OCP Global Summit.
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Wiwynn showcased AI platforms, thermal engineering and optical interconnect technologies at the 2026 OCP Global Summit.
Wiwynn showcased next-generation AI infrastructure at the 2026 OCP Global Summit in San Jose on Oct. 12, 2026. Highlights included rack-scale platforms for NVIDIA Vera Rubin NVL72 and AMD’s Helios rackscale architecture, targeting large-scale AI deployment. Unveiled advanced liquid-cooling concepts aimed at higher rack