TSMC to manufacture Xiaomi's new Xring O3 chip
TSMC will reportedly manufacture Xiaomi's in-house Xring O3 smartphone processor using 3nm technology, and the chip is expected to power Xiaomi's upcoming flagship foldable phone.
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TSMC will reportedly manufacture Xiaomi's in-house Xring O3 smartphone processor using 3nm technology, and the chip is expected to power Xiaomi's upcoming flagship foldable phone.