Mi Technovation's Packaging Arm Files for Singapore IPO
Mi Technovation's packaging materials manufacturing arm has filed for an initial public offering in Singapore, which will comprise a placement and a public offer.
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Mi Technovation's packaging materials manufacturing arm has filed for an initial public offering in Singapore, which will comprise a placement and a public offer.
Mi Material has filed a prospectus for its Singapore IPO, which will include both a placement and a public offer.