Lumentum teams with Qualcomm, Corning for optical die — to — die interconnect demo at ECOC 2026
Lumentum plans a joint ECOC 2026 demonstration with Qualcomm Technologies, Corning on high-density optical die-to-die connectivity for AI scale-up. Board-level showcase targets co-packaged optics, near-packaged optics using emerging interfaces such as UCIe over multimode fiber spanning tens of meters. Proof-of-concept