Lee Says Samsung Packaging Expansion to Spur $30 Billion Investment
South Korean President Lee Jae Myung said Samsung Electronics’ 6 trillion won ($4.48 billion) investment in an HBM chip packaging plant in Asan would be followed by about 40 trillion won in advanced-equipment investment.
South Korean President Lee Jae Myung said on Thursday that Samsung Electronics' KRX:005930 6 trillion won ($4.48 billion) investment in a high-bandwidth memory (HBM) chip packaging plant in Asan, South Korea, would be followed by about 40 trillion won in investment in advanced equipment.Lee made th…