Biren Technology Seeks HK$7 Billion via Share Placement

Shanghai Biren Technology (HKG:6082) is looking to raise HK$7.07 billion via a share placement, according to a Hong Kong bourse filing Sunday. The company is seeking investors for 153 million H shares priced at HK$46.20 each to raise funds to accelerate the commercialization of Biren's products. The shares represent 6.27% of the company's issued share capital, and 5.90% as enlarged by the sale.