BRIEF — Pamica Technology Plans Share Private Placement

Oct 14 (Reuters) — Pamica Technology Corp: SAYS IT PLANS TO RAISE UP TO 1.3 BILLION YUAN ($194.24 million) VIA SHARE PRIVATE PLACEMENT TO FUND PROJECTS, REPLENISH CAPITAL Source text Further company coverage: ($1 = 6.6926 Chinese yuan renminbi) (Reporting by Beijing Newsroom) ((Shi.Bu@thomsonreuters.com;)