Siebert says AI trade shifts to structural bottlenecks as memory pricing power faces new capacity risk

Siebert analysis flagged a shift in AI investing toward structural bottlenecks, warning temporary shortages can fade as new capacity arrives. Memory-stock selloff tied to fears new Chinese and Korean output could erode DRAM and HBM scarcity, pressuring pricing power in 2027-2028. ASML cited record Q3 sales of EUR 11.7 billion, 57.5% gross margin; demand expected to exceed 2027-2028 supply. Customers are seeking ASML tool orders for 2029-2030; no comparable second supplier for the most advanced lithography machines. TSMC seen as the next pricing-power test; focus on how far out clients book leading-edge capacity, not near-term profit prints. Disclaimer: This news brief was created by Public Technologies (PUBT) using generative artificial intelligence. While PUBT strives to provide accurate and timely information, this AI-generated content is for informational purposes only and should not be interpreted as financial, investment, or legal advice. Siebert Financial Corporation published the original content used to generate this news brief on October 14, 2026, and is solely responsible for the information contained therein. (C)