Fujifilm to Expand CMP Slurry Production Capacity in the United States
For best results when printing this announcement, please click on link below: Fujifilm to Expand CMP Slurry Production Capacity in the United States New production capabilities at the Mesa, Arizona, facility will support growing demand for copper interconnects and advanced packaging applications FUJIFILM Corporation will expand its semiconductor materials business by enhancing production facilities for copper interconnect CMP (Chemical Mechanical Planarization) slurries(*1) at the FUJIFILM Electronic Materials U.S.A., Inc. production site in Mesa, Arizona. Fujifilm will also establish new production facilities capable of multi-product manufacturing of CMP slurries for diversified semiconductor manufacturing processes, including advanced packaging applications. The investment, totaling $18 million USD (approximately ¥3 billion), addresses increasing demand for copper interconnect CMP slurries, and supports long-term growth in advanced logic, advanced memory and advanced packaging applications. “The advanced semiconductor market has entered a period of significant growth, driven by the rapid expansion of demand related to artificial intelligence,” says Brian O’Donnelly, president & C
, Inc. production site in Mesa, Arizona. Fujifilm will also establish new production facilities capable of multi-product manufacturing of CMP slurries for diversified semiconductor manufacturing processes, including advanced packaging applications. The investment, totaling $18 million USD (approximately ¥3 billion), addresses increasing demand for copper interconnect CMP slurries, and supports long-term growth in advanced logic, advanced memory and advanced packaging applications.
, Inc. and corporate vice president, FUJIFILM Corporation. ” In particular, demand for CMP slurry for copper interconnects, a product for which Fujifilm has a leading global market share, is increasing in the advanced logic and memory sectors. In the United States, major semiconductor manufacturers continue to invest in new and expanded production facilities, resulting in high demand for semiconductor materials.
, Inc will expand its CMP slurry production in Mesa, Arizona. In addition to expanding capacity for copper interconnect CMP slurries used in BEOL(*2) processes, Fujifilm will establish new production facilities capable of manufacturing a wide range of CMP slurry products for FEOL(*3), MOL(*4) and advanced packaging applications, including hybrid bonding. The new production facilities will serve as a bridge between product development and commercial manufacturing, enabling technologies developed at the Arizona site’s global CMP slurry R&D center to be transferred quickly into mass production. The expanded production line is scheduled to begin operations in 2027.
Once operational, CMP slurry production capacity at Fujifilm’s Mesa facility will further support medium- and long-term growth in demand. Going forward, Fujifilm will continue to provide a broad portfolio covering nearly all semiconductor manufacturing processes, from leading-edge to legacy nodes. Leveraging its global manufacturing network across Japan, the United States, Europe and Asia, together with its strong R&D capabilities, Fujifilm will offer one-stop solutions that help address customers’ challenges and contribute to the continued development of the semiconductor industry.
About FUJIFILM Electronic Materials FUJIFILM Electronic Materials operates manufacturing facilities in Asia, the United States and Europe, and offers a wide range of electronic materials required to produce semiconductors. These materials include photoresists, photolithography-related materials, CMP slurries, post-CMP cleaners, thin-film materials, photosensitive insulating materials such as polyimides under the ZEMATES™ brand, high-purity process chemicals, and ultra-pure solvents. Fujifilm also provides Wave Control Mosaic™, a group of functional materials including color filter materials for image sensors.
With an extensive portfolio covering semiconductor manufacturing processes from leading-edge to legacy nodes, FUJIFILM Electronic Materials maintains a global supply chain with manufacturing and research and development sites in Asia, the United States, and Europe. By providing a one-stop solution to address customer needs, the company contributes to the advancement of the semiconductor industry. (*1) CMP slurry is an abrasive material used to uniformly flatten semiconductor surfaces where wiring and insulating films of varying hardness coexist.
(*2) BEOL (Back End of Line): The wiring process in semiconductor manufacturing in which devices such as transistors formed on a wafer are interconnected with metal wiring layers, enabling electrical signal transmission throughout the integrated circuit. (*3) FEOL (Front End of Line): The process of forming semiconductor devices, such as transistors, capacitors, and resistors, on the surface of a silicon wafer. (*4) MOL (Middle of Line): The intermediate interconnection process that connects the terminals of transistors formed during FEOL to the first layer of metal interconnects. S.
Media Contacts Christopher Smalley Sr. , Inc. com) | 617-529-5323 Robert Wallace Sr. Manager, Corporate Communications FUJIFILM Holdings America Corp.
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