Techwing extends Micron Malaysia test equipment supply contract end date to Nov. 6

Techwing corrected its disclosure for a semiconductor test equipment supply contract with Micron Memory Malaysia, extending the contract end date to 2026-11-06 from 2026-10-02 due to delayed delivery timing pushing back cash collection; all products were delivered on 2026-09-04. Contract value remains KRW 22.86 billion (14.37% of 2025 consolidated revenue).