Lumentum to demo 1060nm VCSEL die-to-die interconnect with Qualcomm, Corning
Lumentum announced a joint demonstration with Qualcomm Technologies and Corning of a high-density 1060 nm VCSEL optical die-to-die interconnect for AI scale-up at ECOC 2026.
Lumentum said it will jointly demonstrate with Qualcomm Technologies and Corning a high-density 1060 nm VCSEL optical die-to-die interconnect for AI scale-up at ECOC 2026. The company said the demonstration is targeting up to ~1 Tb/s/mm shoreline density, with line-of-sight to ~4 Tb/s/mm.