Taiwan breaks ground on Kaohsiung advanced packaging park anchored by TSMC
Taiwan broke ground on an advanced packaging industrial park in Kaohsiung, with TSMC planning facilities for technology validation and talent training.
Taiwan broke ground on a new advanced packaging industrial park in the southern city of Kaohsiung on Monday, with TSMC TWSE:2330 planning to establish facilities for technology validation and talent training. TSMC, the world's largest contract chipmaker, will build two buildings at the site.