MACOM announces 3.2T optical connectivity front-end chipset
MACOM said it introduced a front end chipset solution for 3.2T applications aimed at accelerating next generation optical interconnect development for AI infrastructure.
LOWELL, Mass., Sept. 17, 2026 (GLOBE NEWSWIRE) -- MACOM Technology Solutions Inc. (“MACOM”), a leading supplier of semiconductor products, said it has announced a front-end chipset solution for 3.2T applications. The company said the chipset is designed to accelerate development of next-generation optical interconnects for AI infra…