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NewPhotonics and Tower Semiconductor start high-volume shipments for AI interconnect

NewPhotonics and Tower Semiconductor said they have begun high-volume shipments of laser-integrated, serviceable optical engine PICs for AI interconnect, targeting scale-out and scale-up use cases. The companies cited commercialization of 800G to 1.6T PICs with external pluggable and CPX MSA-compliant NPO socket pluggable solutions built on a PH18DA platform.

TSEM

NewPhotonics and Tower Semiconductor said they have commercialized scale manufacturability of 800G to 1.6T PICs in external pluggable and CPX MSA compliant NPO socket pluggable solutions built on the PH18DA platform designed for high-density monolithic laser integration, SOAs, modulators and detectors. MIGDAL HAEMEK, Israel, and TEL AVIV, Israel…

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