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NewPhotonics and Tower Semiconductor start high-volume shipments for AI interconnect

NewPhotonics and Tower Semiconductor said they have begun high-volume shipments of laser-integrated, serviceable optical engine PICs for AI interconnect, targeting scale-out and scale-up use cases. The companies cited commercialization of 800G to 1.6T PICs with external pluggable and CPX MSA-compliant NPO socket pluggable solutions built on a PH18DA platform.

TSEM

6T PICs in external pluggable and CPX MSA compliant NPO socket pluggable solutions built on the PH18DA platform designed for high-density monolithic laser integration, SOAs, modulators and detectors. MIGDAL HAEMEK, Israel, and TEL AVIV, Israel…