NXP secures $250M EIB loan to expand Malaysia back-end ops
NXP Semiconductors announced a $250.0 million unsecured senior loan facility with the European Investment Bank to fund expansion of its assembly and test (back-end) operations in Kuala Lumpur, Malaysia.
NXP Semiconductors said it has secured a $250.0 million unsecured senior loan facility with the European Investment Bank to fund expansion of its assembly and test back-end operations in Kuala Lumpur, Malaysia. The facility allows borrowings in U.S. Dollars or Euros, at fixed or floating rates, with the proceeds earmarked for the Malaysia back-end buildout.