NXP secures $250M EIB loan to expand Malaysia back-end ops
NXP Semiconductors announced a $250.0 million unsecured senior loan facility with the European Investment Bank to fund expansion of its assembly and test (back-end) operations in Kuala Lumpur, Malaysia.
NXP Semiconductors announced a $250.0 million unsecured senior loan facility with the European Investment Bank to fund the expansion of its assembly and test (back-end) operations in Kuala Lumpur, Malaysia.
The facility permits borrowings in U.S.
Dollars or Euros at fixed or floating rates, with pr…